PV09500 - SEMI PV95 - Test Method for Metal Wrap Through Solar Cell Via Resistance StdTpc-Electronic Data Interchange to be published March 2003

to be published March 2003

This Specification provides standardized behavior for lithography

FPD製造に使用するプロセスツールのツールポートに関わる主要な要求事項を規定する。 これら主要要求事項の目的は，それを標準化することによって，搬送装置とツール間のインタフェースをうまく機能させることにある。 この標準化は，搬送装置の選択に自由度を持たせながら，コスト低減に配慮したインタフェースを奨励することを目的とする。

1  This Standard specifies the classes that suppliers are to use to describe essential data

The distributions can be based on a theoretical model or on empirical information obtained from manufacturing data

PV09500 - SEMI PV95 - Test Method for Metal Wrap Through Solar Cell Via Resistance StdTpc-Electronic Data Interchange to be published March 2003The purpose of this Document is to standardize a fast and accurate test method for determining metallized vias resistance of metal wrap through (MWT) solar cells. The vias are a must and key design for MWT cells. The metallization within vias plays an important role for the performance of MWT solar cells because the generated current collected by the front fingers will be transferred through the vias to the rear side of the cells. If vias